Keysight and Intel Weld Next-Gen AI with EMIB-T Breakthrough

Silicon Sparks: A Leap for Packaging Technology

Keysight Technologies and Intel Foundry have joined forces to accelerate the development of EMIB-T, an advanced packaging technology designed for AI workloads and hyperscale data centers. This collaboration marks a significant push to meet the performance and bandwidth demands of next-gen compute-intensive applications. EMIB-T enhances Intel’s longstanding Embedded Multi-die Interconnect Bridge (EMIB) tech by enabling tighter integration of chiplets, reducing latency while increasing power efficiency. As AI models grow larger and more complex, this innovation promises to streamline data flow and minimize bottlenecks at scale.

Testing the Limits with AI-Powered Validation

To bring EMIB-T to life, Keysight is leveraging its suite of high-speed digital test solutions, including PathWave Advanced Design System and Signal Integrity software. These tools will simulate and validate EMIB-T’s performance early in the design process, allowing engineers to optimize layout and signal integrity before fabrication begins. This collaborative, simulation-driven approach can drastically reduce development cycles, a critical necessity in an AI-driven world that demands speed-to-market above all else. The partnership exemplifies the kind of cross-industry synergy needed to build the chip systems of tomorrow.