Apple’s 2027 iPhone Gets Smarter with On-Device AI

Next-Gen Hardware for AI

Apple is reportedly adopting High Bandwidth Memory (HBM) and Through-Silicon Via (TSV) technology in the iPhone due in 2027. These components will enable the phone to run massive AI models locally, without relying on cloud services.

Faster, Smarter—and Pricier

This leap could significantly enhance iPhone capabilities, making them more responsive and intelligent. However, industry analysts believe this hardware shift will also drive up device costs, reinforcing Apple’s premium positioning.